Diplomatic representatives of Taiwan and Poland signed a memorandum of understanding (MoU) Tuesday to establish a working group that will help build cooperation between the two sides on cutting-edge technologies in the semiconductor industry.
The MoU was signed by representatives at the Polish Office in Taipei and the Taipei Representative Office in Poland during a video conference.
“The aim of the MoU is to foster close bilateral collaboration between Poland and Taiwan in the field of semiconductors and microelectronics, focusing on investment, business, and R&D cooperation,” said Cyryl Kozaczewski, director of the Polish Office in Taipei, who signed on behalf of the Polish side.
The signing was also witnessed virtually by Polish Deputy Minister of Economic Development and Technology Grzegorz Piechowiak and Taiwan’s representative to the European Union and Brussels Tsai Ming-yen (蔡明彥), who is currently on a visit to Poland as the head of a delegation, according to the Taipei office there.
Tsai’s delegation, comprising experts in the fields of academia, business and technology, is on a trip to Europe Sept. 22-28 to seek collaboration on building a resilient semiconductor supply chain.
Taiwan and Poland agreed in May, during the 10th Polish-Taiwanese economic consultations in Taipei, to establish a working group on semiconductors to share experience and build cooperation in the area, according to the Taipei Representative Office in Poland.
On Tuesday, the working group was officially formed, following the inking of the MoU, according to the Taipei office.
The group will work to facilitate joint activities between Taiwan and Poland in the field of semiconductors and microelectronics, including exhibitions and seminars, the Polish Office in Taipei said in a statement Wednesday.
It will also seek to promote the training of professionals for the semiconductor industry, the office said.
Source: Focus Taiwan News Channel