Taiwan Semiconductor Manufacturing Co. (TSMC) has announced the launch of a scheme to give partner companies early access to 3D silicon stacking and advanced packaging technologies for testing and development purposes.
In a statement, TSMC said the 3DFabric Alliance would give its customers “a head start on their product development.”
According to TSMC, 19 members have joined the 3DFabric Alliance, including Micron Technology, Samsung Memory, SK Hynix, ASE, Siliconware, Amkor, Ibiden and Unimicron.
“3D silicon stacking and advanced packaging technologies open the door to a new era of chip- and system-level innovation,” said L.C. Lu (魯立忠), TSMC fellow and vice president of design and technology platform.
According to Lu, this also requires extensive ecosystem collaboration to help designers navigate the myriad of available options and approaches.
Lu made the remarks Wednesday while announcing the launch of the 3DFabric Alliance at the 2022 Open Innovation Platform (OIP) Ecosystem Forum in Santa Clara, California.
Lu added that through the collective leadership of TSMC and its partners, the new 3DFabric Alliance offered customers an easy and flexible way to unlock the power of 3D IC in their designs.
Source: Focus Taiwan News Channel